DesignCon Celebrates More than 40 Professionals with 2017 Awards for Best Papers

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DesignCon 2018 Call for Papers Opens Mid-May

SAN FRANCISCO (April 18, 2017) – DesignCon, the premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities, announces the recipients of its Best Paper Awards following a successful DesignCon 2017 in Santa Clara, CA, on January 19-21. The winners are recognized for their outstanding contribution to the diverse educational goals of DesignCon. To view the full list of winners, visit:

The 2017 DesignCon Best Paper Award winners have been selected through a two-step review process. First, the DesignCon Technical Program Committee, which is comprised of leading experts in the electronic design space, reviewed all papers for impact, relevance, quality, and originality. The first-round finalists were then judged based on attendee feedback, collected at DesignCon 2017, on the impact of their presentation.

“Congratulations to all finalists and winners of this year’s Best Paper Awards. UBM is pleased to recognize these outstanding papers as the best of the excellent content that DesignCon offers its attendees,” said Naomi Price, DesignCon Conference Content Director. “Each year, this awards program inspires engineers to strive to produce ground-breaking, top-tier content for the technical sessions at DesignCon.”

Winning papers cover four categories of design: Chip-Level Design, Board/System-Level Design, Serial Link Design, and Power & RF Design. A list of the winners is below:

Chip-Level Design
• Characterizing and Selecting the VRM
Steve Sandler, Picotest

Board/System-Level Design
FastBER: A Novel Statistical Method for Arbitrary Transmitter Jitter
Yunhui Chu, Intel Corporation
Alaeddin Aydiner, Intel Corporation
Kai Xiao, Intel Corporation
Beomtaek Lee, Intel Corporation
Dan Oh, Samsung Electronics
Oleg Mikulchenko, Intel Corporation
Adam Norman, Intel Corporation
Rob Friar, Intel Corporation
Charles Phares, Intel Corporation

Non-Destructive Analysis and EM Model Tuning of PCB Signal Traces using the Beatty Standard
Heidi Barnes, Keysight Technologies
José Moreira, Advantest
Manuel Walz, Advantest

RX IBIS-AMI Model Silicon Correlation Metrics and Model Development Methodology
Masashi Shimanouchi, Intel Corporation
Hsinho Wu, Intel Corporation
Mike Peng Li, Intel Corporation

Serial Link Design
Exploring Efficient Variability-Aware Analysis Method for High-Speed Digital Link Design Using PCE
Jan B. Preibisch, Technische Universität Hamburg-Harburg
Torsten Reuschel, Technische Universität Hamburg-Harburg
Katharina Scharff, Technische Universität Hamburg-Harburg
Jayaprakash Balachandran, Cisco Systems Inc.
Bidyut Sen, Cisco Systems Inc.
Christian Schuster, Technische Universität Hamburg-Harburg

• Investigation of Mueller-Muller CDR Algorithms in PAM4 High speed Serial Links
Xun Zhang, Oracle Corporation
Dawei Huang, Oracle Corporation
Jianghui Su, Oracle Corporation
Muthukumar Vairavan, Oracle Corporation
Chai Palusa, Oracle Corporation

• PCIe Gen4 Standards Margin Assisted Outer Layer Equalization for Cross Lane Optimization in a 16GT/s PCIe Link
Mohammad S. Mobin, Broadcom Ltd
Haitao Xia, Broadcom Ltd
Aravind Nayak, Broadcom Ltd
Gene Saghi, Broadcom Ltd
Christopher Abel, Broadcom Ltd
Lane Smith, Broadcom Ltd
Jun Yao, Broadcom Ltd

Power & RF Design
Cost-effective PCB Material Characterization for High-volume Production Monitoring
Yongjin Choi, Hewlett-Packard Enterprise
Christopher Cheng, Hewlett-Packard Enterprise
Yasin Damgaci, Hewlett-Packard Enterprise
Nagaraj Godishala, Hewlett-Packard Enterprise
Yuriy Shlepnev, Simberian

• Overview and Comparison of Power Converter Stability Metrics
Joseph ‘Abe’ Hartman, Oracle
Alejandro ‘Alex’ Miranda, Oracle
Kavitha Narayandass, Oracle
Alexander Nosovitski, Oracle
Istvan Novak, Oracle

• RFI and Receiver Sensitivity Analysis in Mobile Electronic Devices
Antonio Ciccomancini Scogna, Samsung Electronics Mobile Division, HE Group
Hwanwoo Shim, Samsung Electronics Mobile Division, HE Group
Jiheon Yu, Samsung Electronics Mobile Division, HE Group
Chang-Yong Oh, Samsung Electronics Mobile Division, HE Group
Seyoon Cheon, Samsung Electronics Mobile Division, HE Group
NamSeok Oh, Samsung Electronics Mobile Division, HE Group
Dong Sub Kim, Samsung Electronics Mobile Division, HE Group

To view the entire list of recipients, including individual researchers, please visit:

DesignCon 2018 Call for Papers
DesignCon returns to the Santa Clara Convention Center on January 30- February 1, 2018. Call for Papers will begin in mid-May with submissions due by the mid-July, 2017 deadline. To stay updated on next year’s event, visit:

Follow DesignCon online:, @UBMDesignCon,


Media Contacts:

UBM Americas: Jannelle Grigsby,, (310) 857-9020

UBM Americas: Rich Trunzo,, (424) 316-7169

About Advanced Manufacturing Expos & Conferences
DesignCon is the world’s premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This three-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry’s leading experts and solutions providers. More information is available at: DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit

About UBM
UBM Americas, a part of UBM plc, is the largest business-to-business events and trade show organizer in the U.S. Through a range of aligned interactive physical and digital environments, UBM Americas increases business effectiveness for both customers and audiences by cultivating meaningful experiences, knowledge and connections. UBM Americas has offices spanning North and South America, and serves a variety of specialist industries with dedicated events and marketing services covering everything from fashion, tech and life sciences to advanced manufacturing, cruise shipping, specialty chemicals, powersports and automotive, concrete, hospitality, cargo transportation and more. For more information, visit:



April 18, 2017